C1608X6S1H105K080AC
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图片仅供参考，并展示示范产品。 |
尺寸
| 长度(L) | 1.60mm ±0.10mm |
| 宽度(W) | 0.80mm ±0.10mm |
| 厚度(T) | 0.80mm ±0.10mm |
| 端子宽度(B) | 0.20mm Min. |
| 端子间隔(G) | 0.30mm Min. |
| 推荐焊盘布局(PA) |
0.70mm to 1.00mm(Flow Soldering) 0.60mm to 0.80mm(Reflow Soldering) |
| 推荐焊盘布局(PB) |
0.80mm to 1.00mm(Flow Soldering) 0.60mm to 0.80mm(Reflow Soldering) |
| 推荐焊盘布局(PC) |
0.60mm to 0.80mm(Flow Soldering) 0.60mm to 0.80mm(Reflow Soldering) |
电气特性
| 电容 | 1μF ±10% |
| 额定电压 | 50VDC |
| 温度特性 ? | X6S(±22%) |
| 耗散因数 (Max.) | 7.5% |
| 绝缘电阻 (Min.) | 500MΩ |
其他
| 温度范围 | -55～105°C |
| 焊接方法 | 流体回流 |
| AEC-Q200 | NO |
| 包装形式 | 纸编带 (180mm卷筒) |
| 包装个数 | 4000pcs |
